Hall B5 • Stand 734
Eltete TPM Engineering is pleased to announce that it will be exhibiting at CCE International 2017 (Corrugated & Carton Exhibition) during March 21 to 23, at the Munich Trade Fair Centre, Germany.
We look forward to welcoming you at our stand.
- honeycomb board manufacturing technology
- The Box manufacturing technology
- Paper Roll -to- Paper pallet technology